Feature(may vary by option.)

●1. Memory Heatsink : This heatsink fins provide a solution to lower component temperature and is suitable for memory cooling etc. Groove can protect the bump in the middle of the notebook memory module
●2. Compatibility: 1. Type 1 and Type 2 are compatible with single side (memory chip is implemented on one side of the memory module) 2. Type 2 is compatible with the double side (which is called double side which is implemented on both sides of the memory module). 3. Type 3 is compatible with DDR5
●3. Material: Copper; Heatsink Size: 63x23x2mm; With thermal conductive adhesive tape (All sizes are measured by hand, there may be a little deviation. )
●4. 100% Copper Material: Adopts high quality pure copper material, copper thermal conductivity is much more efficient than aluminum alloy, the contact area is increased, and the accumulated heat can be released into the air faster In addition, the groove design further increases the heat dissipation area
●5. Easy to install: first check where you need the heat sink to install; then peel off the protective film; Finally, stick to the components. ● Worry-Free Warranty: We inspect our products thoroughly, but by any chance, if there is any defects in the product you purchased, we will send you a good product as soon as possible. If you have any quality issues, please contact us via "Account Service" → "Order History" → "Sale" → "Ask Questions" in your account service. Please contact us anytime. Please rest assured that we will respond 24 hours a day

[Type 2-1]




[Type 1 - Set of 2]




[Type 3-1]




[Type 1-1]





Description

Memory Heat Sink:
This heatsink fin offers a solution to lowering component temperature and is suitable for memory cooling.

Compatibility:
1. Type 1 and Type 2 are compatible with the single side (memory chip is implemented only on one side of the memory module, called single side).
2. Type 2 is compatible with the double side (which is called double side which is implemented on both sides of the memory module).
3. Type 3 is compatible with DDR5.

Product Specifications:
Material: Copper
Heatsink Size:63*23*2mm
Heat conductive adhesive tape
(All sizes are measured by hand, there may be a little deviation. )

100% Copper Material:
Adopting high quality pure copper material, the conductivity of copper is much more efficient than aluminum alloy, increasing the contact area and can release the accumulated heat into the air faster
In addition, the groove design further increases the heat dissipation area.

EASY TO INSTALL:
First, please check where you need a heat sink.
Then peel off the protective film;
Finally stick to components.