Feature(may vary by option.)

●Eco-friendly lead tin ball, bright and full solder joint, almost smoke, no pungent smell
●Strong welding force, widely used in all kinds of electronic products
●Easy welding, no false welding. 25000pcs/bottle for enough use
●Available in a variety of sizes 0.25mm, 0.35mm, 0.45mm, 0.55mm and 0.65mm
●Mainly used to connect transmission electronic signals of semiconductor wafers, circuit templates, printed circuit boards, and ultra-small ball type tin electronic components

[0.45mm]

[0.55mm]

Description

Specifications: Material: Tin.
Solder flux content: 63%
Tin Ball Diameter: 0.25mm, 0.35mm, 0.45mm, 0.55mm, 0.65mm (optional)
Melting Point: 392°F (183°C).
Operating Temperature: 200~380℃
Bottle Size: 35mm/1.4in(H); 16mm/0.6in(W)
Quantity: 25000pcs/bottle

Package List:
1 bottle x solder ball.

Note:
Bottles contain 25,000 bottles.
Bottle size is fixed.
The larger the diameter of the ball, the larger the load.