Feature

●Free shipping nationwide This product is sold by 1.2 inches (3 cm) cut out, but the amount of micro USB connector can be removed for a single use (about 3 devices). The reverse side of various chips can also be used for soldering.
●Unique research of the formula of rare metal components to create a balanced solder for efficient melting Our actual measurement melting temperature: 122°F (50°C).
●Please melt the same amount of solder to the solder part of the mount you want to remove. The melting point of the fixed part will decrease and increase the fluid time. The second time you melt another foot into the other foot and the conductive heat will make it more fluid and easy to remove.
●It can be removed and removed with minimal heat to prevent the tip burned. (Be sure to use paste or flux to make sure the solder and remover are mixed well.)
●Once fully integrated into the critical pattern area, the remover is first destroyed due to its lack of stiffness and reduced the risk of peeling the substrate with less rigidity.


Description

Product description

Solder Remover (product name:Azuka Remover) is a convenient tool to easily remove solder-mounted components on a substrate. This product is sold by 1.2 inches (3 cm) cut out, but the amount of micro USB connector can be removed for a single use of less than 0.4 inches (1 cm) (about 3 devices). The reverse side of various chips can also be used for soldering. We also sell these blocks for those often used repairers. Product Overview: We have developed a unique research on the formula of rare metal components to achieve a balanced solder for efficient melting. Our actual melting temperature: 122°F (50°C); [How to use] Please melt the same amount of solder in the solder part of the mount parts you want to remove with a solder. The melting point of the fixed part will decrease and increase the amount of liquid time. The second time you melt another foot into the other foot and the conductive heat will make it more fluid and easy to remove. ■ After using the remover, remove the product left on the substrate with the suction line, then install the new part with the lead solder wire (there is no conduction on the remover itself, but not rigidity). ■ Simply heat up the parts that are not suitable for use with ordinary lead solder, parts that need to reflow, or the tip that does not apply external pressure to boiling water can be installed like a lead solder. (If stiffness is required, please reinforce it with epoxy. In addition, the pure remover cannot be used as a substitute for soldering wire for substrates that are heated above 104°F (49°C). Must be mixed with lead solder) ■ It can be removed and removed with minimal heat to prevent the chip burned. ■ If fully melted into the important pattern area, the remover is first destroyed due to its lack of rigidity and reduced the risk of peeling the substrate. ■ For better melting, please dissolve with solder paste or flux.

ご注意(免責)>必ずお読みください

通常のはんだゴテが使えない部分に鉛はんだの代用として使用できますが、剛性が必要な場合は実装部品をエポキシなどで補強してください。また50℃以上に加熱する基板には、純粋リムーバーだけでは半田線の代用として使用できません。鉛はんだと混合する必要があります。