Feature
●One hand can be used alone and can be removed for a long time after 5 minutes of power on
●It has a strong suction power and is an ideal tin removal tool for thin film integrated circuits and large solder joins of large components
●Equipped with 3 specifications nozzles (0.04, 0.06, 0.1 inch (1.0, 1.5, 2.5 mm) for easy replacement
●Great helper to improve work efficiency during maintenance Automatic soldering is fast and convenient
●Includes a nozzle cleaner to help prevent the nozzle clogging next time
Description
How to use: 1. Connect the power supply first, and warm the suction nozzle. 2. It can be used after 5 minutes. 3. Place the suction nozzle on the part that needs to be removed from the solder. 4. Once the solder melts, you can simply press the button to suck out the tin. 5. Hold down the handle switch and remove it from solder joint, release the switch and the pot will be sprayed automatically.
Specifications: Item Type: Electric Solder Soccer Material: Plastic + Stainless Steel Model: BBT-580 Operating Voltage: AC 110 V Heater Power: 30 W Electromagnetic Power: 350 W (momentary) Insulation Class: E Class Work Method: Continuous Product Category: Chip Level Repair Tool - Equipped with 3 Nozzles of Motherboard Repair Tool (approx. 1 mm / 0.04 in / 0.06 mm) / 0.0.06 in / 0.06 in (2.5 mm) 1in)
Total Length: Approx. 9.6 inches (245 mm). Machine Diameter: Approx. 1.3 inches (32 mm). Head Length: Approx. 3.3 inches (85 mm). Package List: 1 x Electric Solder Suction Cup 3 x Nozzle 1 x Nozzle Cleaner 1 x User Manual Note: When cleaning and replacing parts, you need to turn off the power and wait for the tin pump to completely cool down.
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