Feature

●1 liquid room temperature hardening type with high thermal conductivity, silicone for heat dissipation. Simply apply between the CPU and the heat sink to improve the conductivity and fix it. It has a moderate viscosity for excellent work
●Heat dissipation for semiconductor devices such as power transistors, ICs, and CPUs. Filling between transistors, rectifiers, thyristors, etc. and heat sink
●Volume Resistance Ratio (Ω cm): 1.0 x 10 [[15 mm]; Usable Temperature Range: -40 ~ 150 °C; Thermal Conductivity (W/M/K): 0.92 °C; Viscosity (Pa/S) (Pa·s) 85 ~ 108; Specific Gravity: 2.26; Weight: 0 g
●White paste
●Methyltrimethoxylane, aluminum oxide, silica
●Made in Japan


Description

Product description

This is a one-liquid room temperature curing type that has high thermal conductivity; It improves thermal conductivity and fixes by simply applying between the CPU and the heat sink. It has a moderate viscosity for excellent workability. Heat dissipation for semiconductor devices such as power transistors, rectifiers, thyristors, etc.; Color: White; Capacity: 0.7 oz (20 g); Specific Gravity: 2.26; Volume Resistance. (Ω·cm): 1.0 x 10 [[15 mm]; Usable Temperature Range: -40 - 150 °C; Viscosity (when pasted): 85 - 108 Pa s; Thermal Conductivity: 0.92 W/m; MK

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