[Single Item]
A reliable flux that is specialized in improving the work efficiency of hand soldering.
Flux for electronic components that are compatible with lead free solders.
Provides an active range of high temperature zones suitable for hand soldering.
20ml quality controlled capacity
Passed JIS Z 3197 corrosion testReduces corrosion after soldering from HAKKO 001.
Eliminates the unique "wet" of lead-free solders.
Works well with oxidized substrates for improved work efficiency.
Tightly joins and increases soldering reliability.
Brush cap for smooth work
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Copper plate expansion testProven wet spread from the spread area of the solder. The spread of the solder is evaluated in a pure copper plate under a condition of 250 degrees Celsius and 30 seconds. Conforms to JIS Z 3197. |
Meniscograph testIt has proven to be compatible with oxidized substrates than zero cross time. Conforms to JIS Z 3197. The solder spreads to the substrate (acid washed copper substrate, copper plate that only washes degrease) and measures the time of penetration and evaluates wet expansion. The menicosgraph test is usually used to acid-washed copper sheets, but the same effect can be achieved on copper plates that have only been cleaned with degreasing.) |
Melted solder for gap flow injection testIt contrasts the flow of capillary phenomenon to the gap and demonstrates that skimmer is tightly jointed. Place the same copper plate with a U-shaped bend on a pure copper sheet, and place a certain amount of punched disc-shaped solder and apply flux in gaps.evaluates the flow of the solder when heated for 20 seconds at a temperature of 250 degrees Celsius. |
HAKKO Electronic Flux | HAKKO FS200 Flux 0.7 fl oz (20 ml) | HAKKO Flux Pen | |
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Customer Reviews |
4.2 out of 5 stars
478
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4.3 out of 5 stars
424
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3.8 out of 5 stars
62
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Price | ¥600¥600 | ¥605¥605 | ¥855¥855 |
Type | Flux for electronics | Flux | Flux Pen |
Notes | Copper, electric wire, switch, precision electronic components, etc. | Eliminates the unique "wet" of lead-free solders. | The wet performance is improved by applying it during soldering or modification. |