Feature

●CS-FLUX converts to liquid when heated to approximately 150 degrees Celsius and completely covers the slight gap between BGA parts and PCB. In this way, all solder balls are covered with CS-FLUX and all PCB and parts pads and balls are protected from oxidation when reflowing or removing BGA parts
●CS-FLUX is not clean flux, so it will not corrode if you dont wash it, but it is very easy to clean with alcohol if necessary. Will not corrode PCB or components
●Because CS-FLUX is a liquid form, it takes very small amounts for one repair, and the working environment is very clean. CS-FLUX is lead free, halogen free, and has minimal amount of perfume
●CS-FLUX is extremely sticky and is specifically designed to hold solder balls inside the stencil during the reball process. It is also great for reflow of BGA parts (with heat gun) when no equipment required for the reball process. Because of the liquid, even the most experienced technicians can find it for micro soldering
●CS-FLUX is made in EU(Greece). We have inventory all over the world, and we can ship it to our customers


Description

"CS FLUX is a flux designed for BGA reball, rework, and reflow. Also suitable for micro solder rings. CS-FLUX is a low-viscosity flux designed by a computer system research team to cover the special needs of flux use in commercial electronics soldering repairs such as laptops, game consoles, etc.

Set Contents: CS-FLUX 0.2 oz (5 g) syringe x 1

1 x 1.6mm chip that is easy to apply.

No expiration date. Protect from heat and sunlight. We recommend storing it in a fridge for long term storage. Made in Greece (EU)