Feature

●Environmentally friendly paper packaging
●Composition: 60% tin / 40% lead
●Melting Point: 183-190 degrees Celsius
●Wire diameter: 0.03 in (0.8 mm)
●Reel Spool: Approx. 2.5 oz (70 g), Approx. 65.9 ft


Description

Goot SE-76008 Lead Solder for Precision Printed Circuit Boards, 0.03 inch (0.8 mm), 60% Tin, 40% Lead, 2.5 oz (70 g), Reel Spool, Resin Included, Made in Japan