Feature●Environmentally friendly paper packaging●Composition: 60% tin / 40% lead●Melting Point: 183-190 degrees Celsius●Wire diameter: 0.03 in (0.8 mm)●Reel Spool: Approx. 2.5 oz (70 g), Approx. 65.9 ftDescription
Goot SE-76008 Lead Solder for Precision Printed Circuit Boards, 0.03 inch (0.8 mm), 60% Tin, 40% Lead, 2.5 oz (70 g), Reel Spool, Resin Included, Made in Japan