Feature

●Special filler is formulated to be evenly dispersed for high heat transfer. Thermal conductivity: 4.0 W/m, K
●Because of its high flexibility, it adheres to uneven surfaces and rapidly releases heat from the heating element to the heat dissipation. Hardness under Asscar C5
●The insulation type has high insulation performance of 10-15. CTI = 600 level
●High compression, can be compressed to less than half thick, greatly reducing thermal resistance
●The characteristics of silicone resin make it highly waterproof and dustproof


Description

Soft material high performance heat dissipation rubber Heat conductor to fill gaps When applied to a substrate, it is a very soft material that covers the entire contact surface even if the surface is uneven and can effectively absorb heat from each component or substrate, and transfer heat to the heat sink or heat dissipation. The soft material will not put any strain on the substrate or enclosure. The heat source is affixed to the heat source, and use it closely to the heat dissipation or enclosure.
Special filler is formulated to be evenly dispersed for high heat transfer. Thermal conductivity: 4.0 W/m, K
Because of its high flexibility, it adheres to uneven surfaces and rapidly releases heat from the heating element to the heat dissipation. Hardness under Asscar C5
The insulation type has high insulation performance of 10-15. CTI = 600 level
High compression, can be compressed to less than half thick, greatly reducing thermal resistance.
The characteristics of silicone resin make it highly waterproof and dustproof.
Flexible under a wide range of temperature conditions Protects electronics from vibrations Working temperature range from -40℃ to +200℃
Dimensions: 3.1 x 3.1 x 0.2 inches (80 x 8
Used for cooling power conditioners, inverters, LED lighting, industrial equipment substrates and more.
RoHS 2.0 compliant product



From the Manufacturer



11

Thermal conductivity 4.0 W/m K heat dissipation rubber

Super soft, soft material with high heat dissipation conduction rubber gap filling

22

Soft material

Super soft and can be compressed to half or less.Compression reduces thermal resistance.

33

Stays close to uneven areas

It adheres to even uneven surfaces, and efficiently absorbs heat from the entire heat generating parts and substrates, and transfer heat to the heat dissipation device.

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Product description

Soft material high performance heat dissipation rubber Heat conductor to fill gaps When applied to a substrate, it is a very soft material that covers the entire contact surface even if the surface is uneven and can effectively absorb heat from each component or substrate, and transfer heat to the heat sink or heat dissipation. The soft material will not put any strain on the substrate or enclosure. The heat source is affixed to the heat source, and use it closely to the heat dissipation or enclosure.
Special filler is formulated to be evenly dispersed for high heat transfer. Thermal conductivity: 4.0 W/m, K
Because of its high flexibility, it adheres to uneven surfaces and rapidly releases heat from the heating element to the heat dissipation. Hardness under Asscar C5
The insulation type has high insulation performance of 10-15. CTI = 600 level
High compression, can be compressed to less than half thick, greatly reducing thermal resistance.
The characteristics of silicone resin make it highly waterproof and dustproof.
Flexible under a wide range of temperature conditions Protects electronics from vibrations Working temperature range from -40℃ to +200℃
Dimensions: 3.1 x 3.1 x 0.2 inches (80 x 8
Used for cooling power conditioners, inverters, LED lighting, industrial equipment substrates and more.
RoHS 2.0 compliant product